Provided is a electroconductive resin body formed of fiber-reinforced resin including resin and a plurality of fiber strings formed of at least one selected from carbon fiber, high-strength fiber and glass fiber, the resin impregnating between the fiber strings, wherein the fiber strings are metal-plated. In the vehicle grounding structure, while the electroconductive resin body is used as a vehicle body, the minus terminals of vehicle-mounted devices VD and of a vehicle battery B are electrically connected to locations in the electroconductive resin body that have the metal-plated fiber strings arranged therein.


    Access

    Download


    Export, share and cite



    Title :

    ELECTROCONDUCTIVE RESIN BODY AND VEHICLE GROUNDING STRUCTURE


    Contributors:

    Publication date :

    2017-03-02


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H02G INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES , Verlegen oder Installieren elektrischer Kabel oder Leitungen, Verlegen oder Installieren kombinierter optischer und elektrischer Kabel oder Leitungen / B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H01B CABLES , Kabel



    Electroconductive resin body and vehicle grounding structure

    KONDO HIROKI / YOSHINAGA SATORU | European Patent Office | 2019

    Free access

    RESIN VEHICLE BODY GROUNDING STRUCTURE

    YAGI DAISUKE | European Patent Office | 2015

    Free access

    RESIN VEHICLE BODY GROUNDING STRUCTURE

    YAGI DAISUKE | European Patent Office | 2019

    Free access

    Resin vehicle body grounding structure

    YAGI DAISUKE | European Patent Office | 2019

    Free access

    Resin vehicle body grounding structure

    YAGI DAISUKE | European Patent Office | 2020

    Free access