A connection system includes a first adhesion segment, on which a first planar bonding region is formed; a second adhesion segment, on which a second planar bonding region is formed, which is shaped so as to be complementary to the first planar bonding region, and a solidifiable, liquid bonding substance. The first planar bonding region and/or the second planar bonding region are each provided with receiving openings. The receiving openings extend like capillaries through each bonding region into the interior of each adhesion segment and, in order to form an integral bond between the first adhesion segment and the second adhesion segment, are designed such that the receiving openings receive the liquid bonding substance due to capillary ascension during application of the liquid bonding substance onto each bonding region.
CONNECTION SYSTEM, CONNECTION ARRANGEMENT AND METHOD
2016-09-22
Patent
Electronic Resource
English