A connection system includes a first adhesion segment, on which a first planar bonding region is formed; a second adhesion segment, on which a second planar bonding region is formed, which is shaped so as to be complementary to the first planar bonding region, and a solidifiable, liquid bonding substance. The first planar bonding region and/or the second planar bonding region are each provided with receiving openings. The receiving openings extend like capillaries through each bonding region into the interior of each adhesion segment and, in order to form an integral bond between the first adhesion segment and the second adhesion segment, are designed such that the receiving openings receive the liquid bonding substance due to capillary ascension during application of the liquid bonding substance onto each bonding region.


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    Titel :

    CONNECTION SYSTEM, CONNECTION ARRANGEMENT AND METHOD


    Beteiligte:
    BENTHIEN HERMANN (Autor:in) / POPPE ANDREAS (Autor:in) / SCHÄFER BASTIAN (Autor:in)

    Erscheinungsdatum :

    22.09.2016


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B64C AEROPLANES , Flugzeuge / B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM , Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse / B64G Raumfahrt , COSMONAUTICS



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