A magnetic field sensor package is disclosed. The package includes a substrate that has a front side and a back side opposite the front side. The substrate can comprise a lead frame. The package also includes a first magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package also includes a second magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package further includes a magnet that is disposed on the back side of the substrate. The magnet can provide a bias field for the first magnetic field sensor die and the second magnetic field sensor die. The package can also include a molding material that is disposed about the lead frame, the first magnetic field sensor die, the second magnetic field sensor die, and the magnet.


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    Title :

    Magnetic field sensor package


    Contributors:

    Publication date :

    2022-10-04


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    G01D MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE , Anzeigen oder Aufzeichnen in Verbindung mit Messen allgemein / B62D MOTOR VEHICLES , Motorfahrzeuge / G01R Messen elektrischer Größen , MEASURING ELECTRIC VARIABLES / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H02K Dynamoelektrische Maschinen , DYNAMO-ELECTRIC MACHINES



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