A magnetic field sensor package is disclosed. The package includes a substrate that has a front side and a back side opposite the front side. The substrate can comprise a lead frame. The package also includes a first magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package also includes a second magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package further includes a magnet that is disposed on the back side of the substrate. The magnet can provide a bias field for the first magnetic field sensor die and the second magnetic field sensor die. The package can also include a molding material that is disposed about the lead frame, the first magnetic field sensor die, the second magnetic field sensor die, and the magnet.
Magnetic field sensor package
04.10.2022
Patent
Elektronische Ressource
Englisch
IPC: | G01R Messen elektrischer Größen , MEASURING ELECTRIC VARIABLES / H02K Dynamoelektrische Maschinen , DYNAMO-ELECTRIC MACHINES / H10N / G01D MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE , Anzeigen oder Aufzeichnen in Verbindung mit Messen allgemein / B62D MOTOR VEHICLES , Motorfahrzeuge |
British Library Conference Proceedings | 1993
|NTIS | 1993
|NTRS | 1993
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