A power module having dual-sided cooling is provided with a semiconductor chip between an upper board and a lower board of the power module. In particular, the upper board includes: a first bonding layer made of a dielectric material, and a first electrode made of a copper material and provided on a first surface of the first bonding layer, and the first electrode is connected to the semiconductor chip. The lower board includes: a second bonding layer made of a dielectric material, and a second electrode made of a copper material and provided on a first surface of the second bonding layer, and the second electrode is connected to the semiconductor chip. More specifically, a thickness of the first electrode is greater than a thickness of the first bonding layer, and a thickness of the second electrode is greater than a thickness of the second bonding layer.


    Access

    Download


    Export, share and cite



    Title :

    Power module having dual-sided cooling


    Contributors:

    Publication date :

    2018-12-04


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen / H02P CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS , Steuern oder Regeln von elektrischen Motoren, elektrischen Generatoren, dynamoelektrischen Umformern



    Electrothermal Characterization of Double-Sided Cooling Si Power Module

    Sanchez, Sébastien / Nguyen, C. / Cadile, Claudia et al. | British Library Conference Proceedings | 2020


    COOLING MODULE WITH DUAL FAN

    PARK DAE SUK / KIM BYUNG JOO / CHOI JUNG BUM | European Patent Office | 2015

    Free access

    COOLING MODULE WITH DUAL FAN

    European Patent Office | 2019

    Free access

    Design and analysis of innovative dual sided cooling of IGBT modules

    Marcinkowski,J. / Remsburg,R. / Infineon,El Segundo,US et al. | Automotive engineering | 2015


    Design and Fabrication of a SiC-Based Power Module with Double-Sided Cooling for Automotive Applications

    Brinkfeldt, Klas / Ottosson, Jonas / Neumaier, Klaus et al. | Springer Verlag | 2015