A power module having dual-sided cooling is provided with a semiconductor chip between an upper board and a lower board of the power module. In particular, the upper board includes: a first bonding layer made of a dielectric material, and a first electrode made of a copper material and provided on a first surface of the first bonding layer, and the first electrode is connected to the semiconductor chip. The lower board includes: a second bonding layer made of a dielectric material, and a second electrode made of a copper material and provided on a first surface of the second bonding layer, and the second electrode is connected to the semiconductor chip. More specifically, a thickness of the first electrode is greater than a thickness of the first bonding layer, and a thickness of the second electrode is greater than a thickness of the second bonding layer.
Power module having dual-sided cooling
2018-12-04
Patent
Elektronische Ressource
Englisch
IPC: | H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen / H02P CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS , Steuern oder Regeln von elektrischen Motoren, elektrischen Generatoren, dynamoelektrischen Umformern |
Design and analysis of innovative dual sided cooling of IGBT modules
Kraftfahrwesen | 2015
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