To provide an electronic component module capable of reducing the workload of assembly.SOLUTION: An electronic component module 1 includes a first substrate 2 on which an electronic component 6 is mounted, a second substrate 3 disposed opposite the first substrate 2 in a stacking direction Z, a plurality of header pins 5a disposed between the first substrate 2 and the second substrate 3 and electrically connecting the first substrate 2 and the second substrate 3, and a frame 4 that holds the first substrate 2 and the second substrate 3 at intervals along the stacking direction Z. The frame 4 is configured to integrally include holding portions 12, 12A that hold the plurality of header pins 5a.SELECTED DRAWING: Figure 3

    【課題】組立の作業負荷を軽減することができる電子部品モジュールを提供する。【解決手段】電子部品モジュール1は、電子部品6が実装される第一基板2と、第一基板2と積層方向Zに対向して配置される第二基板3と、第一基板2と第二基板3との間に配置され、当該第一基板2と第二基板3を電気的に接続する複数のヘッダーピン5aと、第一基板2及び第二基板3を積層方向Zに沿って間隔をあけて保持するフレーム4とを備える。このフレーム4は、複数のヘッダーピン5aを保持する保持部12,12Aを一体に含んで構成される。【選択図】図3


    Access

    Download


    Export, share and cite



    Title :

    ELECTRONIC COMPONENT MODULE


    Additional title:

    電子部品モジュール


    Contributors:
    ASADA SHOTA (author)

    Publication date :

    2024-12-12


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Japanese


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H02G INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES , Verlegen oder Installieren elektrischer Kabel oder Leitungen, Verlegen oder Installieren kombinierter optischer und elektrischer Kabel oder Leitungen



    ELECTRONIC COMPONENT MODULE

    TAKEUCHI KUNIHIKO / HAMAGUCHI YUKO / ISAKA NAOKI | European Patent Office | 2018

    Free access

    ENCLOSURE OF ELECTRONIC COMPONENT MODULE

    YOSHIDA SHINYA / NAKANISHI RAITA | European Patent Office | 2021

    Free access

    HOUSING OF ELECTRONIC COMPONENT MODULE

    YOSHIDA SHINYA / NAKANISHI RAITA | European Patent Office | 2018

    Free access

    ELECTRONIC COMPONENT MODULE, ATTACHMENT STRUCTURE OF THE ELECTRONIC COMPONENT MODULE AND HOUSING, AND CONTROL APPARATUS WITH THEM

    SUZUKI TOSHIAKI / KAWAGUCHI TAKESHI / SUZUKI MASAHIDE et al. | European Patent Office | 2020

    Free access

    ELECTRONIC COMPONENT MODULE, CONNECTION STRUCTURE AND CONNECTION METHOD OF IN-VEHICLE POWER TRUNK BUS BAR AND ELECTRONIC COMPONENT MODULE

    USAMI TAKEHIRO / RIKIHISA HIROAKI / SUGIMURA TAKEZO | European Patent Office | 2019

    Free access