To provide a liquid immersion cooling device with a reinforced resistance to environments which can present a high cooling efficiency and can be designed and manufactured easily.SOLUTION: The present invention relates to a liquid immersion cooling device (10) for a circuit board (141) at least having an electronic circuit part which generates heat, the liquid immersion cooling device including: a pressure container (100) made of a container body (101) and at least one lid (110, 120) joined to the container body removably and filled with a liquid refrigerant (130); and an attachment member (103, 104) provided in the pressure container, the attachment member arranging the circuit board in the container to surround the periphery of the circuit board with a refrigerant. A refrigerant exit (111) and a refrigerant entrance (112) are provided in one lid (110). The refrigerant in one side of the circuit board is forced to flow out of the pressure container through the refrigerant exit and is forced to enter the other side of the circuit board through the refrigerant entrance.SELECTED DRAWING: Figure 1

    【課題】耐環境性が強化され、高い冷却効率を得ることができ、かつ設計および製造が容易である液浸冷却装置を提供する。【解決手段】少なくとも発熱する電子回路部を有する回路基板(141)のための液浸冷却装置(10)であって、容器本体(101)と容器本体に着脱可能に接合された少なくとも1つの蓋(110,120)とからなり、内部が液状の冷媒(130)で満たされた圧力容器(100)と、圧力容器内に設けられ回路基板の周囲が冷媒で囲まれるように回路基板を容器内に配置する取付部材(103、104)と、を有し、一の蓋(110)に冷媒出口(111)と冷媒入口(112)とが設けられ、冷媒出口を通して回路基板の一方の面側の冷媒が圧力容器から強制的に流出し、冷媒入口を通して回路基板の他方の面側へ冷媒が強制的に流入する。【選択図】図1


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    Title :

    LIQUID IMMERSION COOLING DEVICE


    Additional title:

    液浸冷却装置


    Contributors:

    Publication date :

    2023-09-22


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Japanese


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B64G Raumfahrt , COSMONAUTICS / G06F ELECTRIC DIGITAL DATA PROCESSING , Elektrische digitale Datenverarbeitung / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES



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