To provide a tire polishing device that can achieve a target polishing level with high accuracy.SOLUTION: A tire polishing device 10 as one example of embodiments comprises a driving unit 15 that rotates a tire 1, and a polishing unit 20 that polishes a surface of the tire 1 while moving in a tire axial direction. The polishing unit 20 polishes the surface of the tire 1 while moving from an inside to the outside in the tire axial direction, at both sides in the tire axial direction of a tread 2.SELECTED DRAWING: Figure 1
【課題】目的とする研磨レベルを高精度で実現可能なタイヤ研磨装置を提供する。【解決手段】実施形態の一例であるタイヤ研磨装置10は、タイヤ1を回転させる駆動ユニット15と、タイヤ軸方向に移動しながらタイヤ1の表面を研磨する研磨ユニット20とを備える。研磨ユニット20は、トレッド2のタイヤ軸方向両側において、タイヤ軸方向内側から外側に移動しながらタイヤ1の表面を研磨する。【選択図】図1
TIRE POLISHING DEVICE
タイヤ研磨装置
2023-09-06
Patent
Electronic Resource
Japanese
IPC: | B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING , Maschinen, Einrichtungen oder Verfahren zum Schleifen oder Polieren / B29D PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE , Herstellen besonderer Gegenstände aus Kunststoff oder aus Stoffen in plastischem Zustand / B60C VEHICLE TYRES , Fahrzeugreifen |
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