To provide a tire grounding shape analysis device that can accurately analyze kinetic grounding property of a tire in a short time, and to provide a tire grounding shape analysis method.SOLUTION: A tire grounding shape analysis device includes: a lighting unit for irradiating a grounding surface of a tire, which is an analysis object, with light for increasing luminance of an edge of a groove provided in a tire tread part; a grounding surface image acquisition unit 32 for acquiring a captured image of the grounding surface of the tire using light radiated by the lighting unit; and a grounding property analysis unit 33 for analyzing a grounding surface image acquired by the grounding surface image acquisition unit 32 to obtain a grounding property.SELECTED DRAWING: Figure 2

    【課題】短い時間でタイヤの動的接地特性を精度良く解析することのできるタイヤ接地形状解析装置およびタイヤ接地形状解析方法を提供する。【解決手段】タイヤ接地形状解析装置は、解析対象であるタイヤの接地面に、タイヤトレッド部に設けられた溝のエッジの輝度を高める光を照射する照明部と、照明部から照射される光によって、タイヤの接地面を撮影した撮影画像を取得する接地面画像取得部32と、接地面画像取得部32によって取得された接地面画像を解析して接地特性を求める接地特性解析部33とを含む。【選択図】図2


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    Title :

    TIRE GROUNDING SHAPE ANALYSIS DEVICE AND TIRE GROUNDING SHAPE ANALYSIS METHOD


    Additional title:

    タイヤ接地形状解析装置およびタイヤ接地形状解析方法


    Contributors:

    Publication date :

    2020-02-06


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Japanese


    Classification :

    IPC:    B60C VEHICLE TYRES , Fahrzeugreifen / G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS , Messen der Länge, der Dicke oder ähnlicher linearer Abmessungen





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