PROBLEM TO BE SOLVED: To provide a mechatronic motor unit which can inhibit temperature rise in a driving unit.SOLUTION: In a driving unit 5 related to a mechatronic motor unit 1, a semiconductor chip CH and a smoothing capacitor C are joined on a second major surface 34 of a substrate 35 having a first major surface 33 facing a motor housing 2a and the second major surface 34 opposite to the first major surface 33. The semiconductor chip CH includes a first end part 36 facing the second major surface 34 of the substrate 35 and a second end part 37 opposite to the first end part 36. The smoothing capacitor C includes a third end part 38 facing the second major surface 34 of the substrate 35 and a fourth end part 39 opposite to the third end part 38. The semiconductor chip CH is thermally connected to a bottom wall part 45 of a cover member 6 at a position closer to the second major surface 34 of the substrate 2 than the fourth end part 39 of the smoothing capacitor C. The bottom wall part 45 of the cover member 6 is thermally connected to the motor housing 2a through a side wall part 46 of the cover member 6.SELECTED DRAWING: Figure 1

    【課題】駆動ユニットでの温度上昇を抑制できる機電一体型モータユニットを提供する。【解決手段】機電一体型モータユニット1に係る駆動ユニット5では、モータハウジング2aに対向する第1主面33とその反対側の第2主面34を有する基板35の第2主面34に、半導体チップCHおよび平滑コンデンサCが接合されている。半導体チップCHは、基板35の第2主面34と対向する第1端部36とその反対側の第2端部37とを含み、平滑コンデンサCは、基板35の第2主面34と対向する第3端部38とその反対側の第4端部39とを含む。半導体チップCHは、平滑コンデンサCの第4端部39よりも基板2の第2主面34に近い位置でカバー部材6の底壁部45と熱的に接続されている。そして、カバー部材6の底壁部45は、当該カバー部材6の側壁部46を介してモータハウジング2aに熱的に接続されている。【選択図】図1


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    Title :

    MECHATRONIC MOTOR UNIT


    Additional title:

    機電一体型モータユニット


    Contributors:
    HIEDA TAKAHITO (author) / YOSHIDA KOUYA (author) / TANI NAOKI (author)

    Publication date :

    2017-12-28


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Japanese


    Classification :

    IPC:    H02K Dynamoelektrische Maschinen , DYNAMO-ELECTRIC MACHINES / B62D MOTOR VEHICLES , Motorfahrzeuge



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