PROBLEM TO BE SOLVED: To provide a semiconductor module with a structure capable of being downsized as compared with the conventional structure and efficiently dissipating heat of a semiconductor element.SOLUTION: The semiconductor module includes an inverter circuit for driving a motor. A lead frame 3 (31, 32) of an internal wiring material has a two-layered three-dimensional wiring structure. A power semiconductor element 2 (21, 22) and two-layered lead frames 3 (31, 32) are alternately stacked. A lead-out part 32H has a surface 32S for radiating heat outward and is so configured that a part of the second layer lead frame 32 is led to a heat radiation surface 31S of the first layer lead frame 31.SELECTED DRAWING: Figure 1

    【課題】従来と比べてさらに小型化を図ることができ、また、半導体素子の熱を効率よく放熱することができる構造とする。【解決手段】モータを駆動させるためのインバータ回路を有する半導体モジュールであって、内部配線材のリードフレーム3(31,32)が2層の立体配線構造であり、パワー半導体素子2(21,22)と2層のリードフレーム3(31,32)が交互に積層され、2層目リードフレーム32の一部が、1層目リードフレーム31の放熱面31Sまで導出された、外部への放熱面32Sを有する導出部32Hである。【選択図】図1


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    Title :

    SEMICONDUCTOR MODULE, DRIVING DEVICE INCLUDING THE SAME, POWER STEERING APPARATUS, AND VEHICLE


    Additional title:

    半導体モジュールと、これを備えた駆動装置、電動パワーステアリング装置および車両


    Contributors:

    Publication date :

    2017-03-23


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Japanese


    Classification :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B62D MOTOR VEHICLES , Motorfahrzeuge / H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS , Anlagen zur Umformung von Wechselstrom in Wechselstrom, von Wechselstrom in Gleichstrom oder umgekehrt, oder von Gleichstrom in Gleichstrom und zur Verwendung in Netzen oder ähnlichen Stromversorgungssystemen





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