PROBLEM TO BE SOLVED: To provide a conductive resin body having conductivity by improving its strength, and a vehicle grounding structure.SOLUTION: Provided is a conductive resin body 10 made of a fiber-reinforced resin in which a resin is impregnated among a plurality of fibers consisting of at least one kind selected from carbon fiber, high strength fiber and glass fiber, and metal plating is applied to the fiber. Also provided is a vehicle grounding structure where the conductive resin body 10 is used as a vehicle body, and further, the minus terminals of an onboard apparatus VD and a vehicle battery B are electrically connected to the arrangement part of the fiber subjected to the metal plating in the conductive resin body 10.SELECTED DRAWING: Figure 1

    【課題】強度の向上を図り、導電性を有する導電性樹脂体及び車両アース構造を提供する。【解決手段】炭素繊維、高強度繊維、及びガラス繊維の少なくとも1種からなる複数本の繊維の間に樹脂が含浸された繊維強化樹脂からなる導電性樹脂体10であって、繊維は、金属メッキが施されている。車両アース構造は、導電性樹脂体10を車両用のボディとすると共に、当該導電性樹脂体10のうち金属メッキが施された繊維の配置箇所に対して、車載機器VD及び車両バッテリBのマイナス端子が電気接続されている。【選択図】図1


    Access

    Download


    Export, share and cite



    Title :

    CONDUCTIVE RESIN BODY AND VEHICLE GROUNDING STRUCTURE


    Additional title:

    導電性樹脂体及び車両アース構造


    Contributors:

    Publication date :

    2017-03-02


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Japanese


    Classification :

    IPC:    H01B CABLES , Kabel / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



    RESIN VEHICLE BODY GROUNDING STRUCTURE

    YAGI DAISUKE | European Patent Office | 2015

    Free access

    RESIN VEHICLE BODY GROUNDING STRUCTURE

    YAGI DAISUKE | European Patent Office | 2016

    Free access

    Resin vehicle body grounding structure

    YAGI DAISUKE | European Patent Office | 2020

    Free access

    RESIN VEHICLE BODY GROUNDING STRUCTURE

    YAGI DAISUKE | European Patent Office | 2019

    Free access

    Resin vehicle body grounding structure

    YAGI DAISUKE | European Patent Office | 2019

    Free access