PROBLEM TO BE SOLVED: To provide a structure capable of being miniaturized while forming the same circuit configuration as the conventional art.SOLUTION: A semiconductor module 1 that has an inverter circuit for driving a motor, has a multilayer structure of lead frames 3A and 3B, and has a wiring structure in which power semiconductor elements 2 (2A and 2B) and the lead frames 3A and 3B are alternately laminated, and has a three-dimensional wiring structure in which one lead frame is soldered to a lower surface electrode 2D of the power semiconductor element 2 (2A), and the other lead frame 3B is soldered to an upper surface electrode 2G.SELECTED DRAWING: Figure 3

    【課題】従来と同じ回路構成としながらも小型化を図ることができる構造とする。【解決手段】モータを駆動させるためのインバータ回路を有する半導体モジュール1は、リードフレーム3A,3Bが多層構造であり、パワー半導体素子2(2A,2B)とリードフレーム3A,3Bが交互に積層された配線構造であって、パワー半導体素子2(2A)の下面電極2Dに一方のリードフレームをはんだ付けし、上面電極2Gに他方のリードフレーム3Bをはんだ付けし、立体配線する構造である。【選択図】図3


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    Title :

    SEMICONDUCTOR MODULE, AND DRIVE DEVICE, ELECTRIC POWER STEERING DEVICE, AND VEHICLE COMPRISING THE SAME


    Additional title:

    半導体モジュールと、これを備えた駆動装置、電動パワーステアリング装置および車両


    Contributors:

    Publication date :

    2017-02-16


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Japanese


    Classification :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B62D MOTOR VEHICLES , Motorfahrzeuge




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