PROBLEM TO BE SOLVED: To provide a thermoplastic elastomer composition which reduces die build-up or foreign matters of a molded article during extrusion molding and has good extrusion moldability.SOLUTION: There is provided a thermoplastic elastomer composition which comprises the following components (A) and (B) and is obtained by dynamically heat-treating a composition comprising 100-500 pts.wt. of the component (B) based on 100 pts.wt. of the component (A) in the presence of a crosslinking agent. Component (A): a polypropylene-based resin containing the following components (A1) and (A2). Component (A1): a polypropylene-based resin having a melting peak temperature of 157°C or more and 175°C or less and a melt flow rate (230°C, 21.2 N) of 0.1-10 g/10 min. Component (A2): a propylene-based random copolymer having a melting peak temperature of 100°C or more and less than 157°C and a melt flow rate (230°C, 21.2 N) of 8-60 g/10 min. Component (B): an ethylene-α-olefin copolymer.SELECTED DRAWING: None
【課題】押出成形時に発生する目ヤニや成形体の異物が低減され、押出成形性が良好な熱可塑性エラストマー組成物を提供する。【解決手段】下記成分(A)及び成分(B)を含み、かつ成分(A)100重量部に対し成分(B)を100〜500重量部含む組成物を架橋剤の存在下で動的熱処理してなる熱可塑性エラストマー組成物。成分(A):下記成分(A1)及び成分(A2)を含むポリプロピレン系樹脂成分(A1):融解ピーク温度が157℃以上175℃以下であり、メルトフローレート(230℃、21.2N)が0.1〜10g/10分であるプロピレン系重合体成分(A2):融解ピーク温度が100℃以上157℃未満であり、メルトフローレート(230℃、21.2N)が8〜60g/10分であるプロピレン系ランダム共重合体成分(B):エチレン・α−オレフィン共重合体【選択図】なし
THERMOPLASTIC ELASTOMER COMPOSITION
熱可塑性エラストマー組成物
2016-11-10
Patent
Electronic Resource
Japanese
IPC: | C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS , Massen auf Basis makromolekularer Verbindungen / B60J WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES , Fenster, Windschutzscheiben und bewegbare Dächer, Türen oder Ähnliches für Fahrzeuge / C08J Verarbeitung , WORKING-UP / C08K Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe , USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS / C09K Materialien für Anwendungen, soweit nicht anderweitig vorgesehen , MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR |
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