In an example, a method is described. The method comprises forming a single hole (216) into a bond gap repair area (118). The method also comprises evacuating, via an adhesive injection apparatus (200) attached to the single hole (216), the bond gap repair area (118) and an injection channel (206) of the adhesive injection apparatus (200). The method also comprises forcing adhesive (205) through the evacuated injection channel (206) and into the evacuated bond gap repair area (118).


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    Title :

    APPARATUS AND METHOD FOR EVACUATED INJECTION REPAIR OF BONDLINE VOIDS AND BONDLINE VOID REPAIRED BY SAID METHOD


    Additional title:

    VORRICHTUNG UND VERFAHREN ZUR EVAKUIERTEN INJEKTIONSREPARATUR VON KLEBSCHICHTHOHLRÄUMEN SOWIE DURCH DIESEM VERFAHREN REPARIERTEN KLEBSCHICHTHOHLRAUM
    DISPOSITIF ET PROCÉDÉ DE RÉPARATION PAR INJECTION SOUS VIDE DES CAVITÉS DE LIGNE DE LIAISON ET CAVITÉ DE LIGNE DE LIAISON RÉPARÉ PAR LEDIT PROCÉDÉ


    Contributors:

    Publication date :

    2024-01-03


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B64F GROUND OR AIRCRAFT-CARRIER-DECK INSTALLATIONS SPECIALLY ADAPTED FOR USE IN CONNECTION WITH AIRCRAFT , Boden- oder Flugzeugträgerdeckeinrichtungen besonders ausgebildet für die Verwendung in Verbindung mit Luftfahrzeugen



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