A power electronics arrangement has a power semiconductor module, with a contact spring, with a load connecting element and with a mounting device which is embodied as part of an electrically operated vehicle. The power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module, and preferably has there a first external contact face for external connection, and the load-connecting element has a second contact face. An electrically conductive pressure contact connection is embodied between the first contact face and the second contact face by a contact spring, wherein the pressure on the contact spring which is necessary for this is implemented by connecting the power semiconductor module in a frictionally locking fashion to the mounting device.


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    Title :

    LEISTUNGSELEKTRONISCHE ANORDNUNG UND FAHRZEUGE HIERMIT


    Additional title:

    POWER ELECTRONICS ASSEMBLY AND VEHICLES WITH SAME
    SYSTÈME ÉLECTRONIQUE DE PUISSANCE ET VÉHICULE EN ÉTANT ÉQUIPÉ


    Contributors:

    Publication date :

    2020-12-30


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    German


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60K Anordnung oder Einbau von Antriebseinheiten oder von Kraft- bzw. Drehmomentübertragungen in Fahrzeugen , ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES



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