A power electronics arrangement has a power semiconductor module, with a contact spring, with a load connecting element and with a mounting device which is embodied as part of an electrically operated vehicle. The power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module, and preferably has there a first external contact face for external connection, and the load-connecting element has a second contact face. An electrically conductive pressure contact connection is embodied between the first contact face and the second contact face by a contact spring, wherein the pressure on the contact spring which is necessary for this is implemented by connecting the power semiconductor module in a frictionally locking fashion to the mounting device.
LEISTUNGSELEKTRONISCHE ANORDNUNG UND FAHRZEUGE HIERMIT
POWER ELECTRONICS ASSEMBLY AND VEHICLES WITH SAME
SYSTÈME ÉLECTRONIQUE DE PUISSANCE ET VÉHICULE EN ÉTANT ÉQUIPÉ
30.12.2020
Patent
Elektronische Ressource
Deutsch
Leistungselektronische Anordnung und Fahrzeug hiermit
Europäisches Patentamt | 2019
|LEISTUNGSELEKTRONISCHE ANORDNUNG UND FAHRZEUG HIERMIT
Europäisches Patentamt | 2021
|Leistungselektronische Anordnung und elektrisches Fahrzeug hiermit
Europäisches Patentamt | 2021
|Das System macht's: Kompakte leistungselektronische Systeme fur Fahrzeuge
British Library Online Contents | 2010
Das System macht's. Kompakte leistungselektronische Systeme für Fahrzeuge
Tema Archiv | 2010
|