A power electronics arrangement has a power semiconductor module, with a contact spring, with a load connecting element and with a mounting device which is embodied as part of an electrically operated vehicle. The power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module, and preferably has there a first external contact face for external connection, and the load-connecting element has a second contact face. An electrically conductive pressure contact connection is embodied between the first contact face and the second contact face by a contact spring, wherein the pressure on the contact spring which is necessary for this is implemented by connecting the power semiconductor module in a frictionally locking fashion to the mounting device.
LEISTUNGSELEKTRONISCHE ANORDNUNG UND FAHRZEUG HIERMIT
POWER ELECTRONICS ASSEMBLY AND VEHICLES WITH SAME
DISPOSITIF ÉLECTRONIQUE DE PUISSANCE ET VÉHICULE CORRESPONDANT
20.01.2021
Patent
Elektronische Ressource
Deutsch
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