The invention discloses a bonding layer and a bonding method of an equal-diameter or small-taper rotary body composite material component and a metal structure. The bonding layer is designed to be of a composite structure of an inner bonding glue layer, a fiber felt with internal glue permeating and an outer bonding glue layer, the bonding layer is used for bonding between a composite material component and a metal structure, the high bonding strength between the composite material component and the metal structure is achieved, and the effect of a thermal strain isolation pad can be achieved. Particularly, the designed bonding layer is used in the bonding process of the equal-diameter or small-taper rotary body composite material component and the metal structure, and the technical problem that degumming is caused by the friction effect when the equal-diameter or small-taper rotary body composite material component is connected to the metal structure in a sleeving mode can be solved; and meanwhile, the technical problem that the assembly clearance is not uniform due to deformation of two equal-diameter or small-taper rotary body components is solved by adopting a guide fixed clearance design, and the method can be widely applied to the field of thermal protection assembly of aerospace crafts.

    本发明公开了一种粘接层及等径或小锥度回转体复合材料构件与金属结构的粘接方法。粘接层设计为内粘接胶层+内部渗胶的纤维毡+外粘接胶层复合结构,将其用于复合材料构件与金属结构之间的粘接,赋予复合材料构件与金属结构之间较高的粘接强度,且可以起到热应变隔离垫的作用。特别是将设计的粘结层用于等径或小锥度回转体复合材料构件与金属结构的粘接过程,可以解决等径或小锥度回转体复合材料构件套接至金属结构时由于摩擦作用而导致脱胶的技术问题,同时采用导向定间隙设计来解决两种等径或小锥度回转体构件因变形带来的装配间隙不均匀的技术问题,可以在航天飞行器热防护装配领域广泛应用。


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    Title :

    Bonding layer and bonding method for equal-diameter or small-taper rotary body composite material component and metal structure


    Additional title:

    一种粘接层及等径或小锥度回转体复合材料构件与金属结构的粘接方法


    Contributors:
    FEI HOUJUN (author) / CHEN ZIANG (author) / LIU PENG (author) / LI JING (author) / SUN JI (author) / CAO JIE (author) / YAO PENGYU (author) / WU WEI (author)

    Publication date :

    2024-05-03


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    C09J ADHESIVES , Klebstoffe / B64G Raumfahrt , COSMONAUTICS



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