The invention relates to the technical field of electronic load cabin structures and thermal management, in particular to an electronic load integrated heat dissipation cabin structure and a design method thereof, the electronic load integrated heat dissipation cabin structure comprises a cabin frame, and an installation space is formed in the cabin frame; the radiator assembly comprises a plurality of radiators, each radiator comprises a plurality of radiating fins which are arranged in parallel at intervals, and the radiating fins extend in the flowing direction of the airflow so that the airflow can penetrate through gaps between the adjacent radiating fins; the flow guide protection part is arranged on the front surface of the cabin body frame, the flow guide protection part is gradually thickened from front to back to form a flow guide structure, and the surface of the flow guide protection part is in smooth transition connection with the surface of the cabin body frame. The electronic load is arranged in the special cabin body frame to meet the setting requirement of the electronic load, meanwhile, the temperature of the cabin body frame is controlled through the multiple radiators, it is guaranteed that the internal electronic load can operate at the appropriate environment temperature, the heat dissipation requirement is met, and the heat dissipation structure is simplified.

    本发明涉及电子载荷舱体结构及热管理技术领域,具体涉及一种电子载荷集成散热舱体结构及设计方法,包括舱体框架,舱体框架内形成安装空间;散热器组件,包括若干散热器,散热器上包括平行间隔设置的若干散热翅片,且散热翅片沿气流的流动方向延伸以使气流从相邻散热翅片的间隙穿过;导流保护件,设置于舱体框架的前表面,导流保护件从前向后逐渐加粗以形成导流结构,且导流保护件的表面与舱体框架的表面顺滑过渡连接。通过将电子载荷设置于专门的舱体框架内满足电子载荷的设置,同时通过多处散热器控制舱体框架的温度,保障内部电子载荷能够在适宜的环境温度下运行,不仅满足散热需求,也简化了散热结构。


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    Title :

    Electronic load integrated heat dissipation cabin structure and design method


    Additional title:

    一种电子载荷集成散热舱体结构及设计方法


    Contributors:
    YE YUANPENG (author) / HE YU (author) / LI YINGJIE (author) / XIE XUEKANG (author) / YIN BENHAO (author) / WANG CHAO (author) / ZHANG QIANG (author) / CHU XIN (author) / HE EN (author) / FAN ZHENGANG (author)

    Publication date :

    2023-03-14


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT / G06F ELECTRIC DIGITAL DATA PROCESSING , Elektrische digitale Datenverarbeitung



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