The invention discloses a ship profile penetrating structure. A through hole for penetrating through the section bar is formed in a wall plate of the ship, the through hole comprises a rectangular hole formed in the wall plate in a penetrating manner, a via hole is formed in the wall plate corresponding to the top of the sectional material, two adjacent edges of the via hole are in arc transition,the via hole is communicated with the through hole, the profile penetrates through the rectangular hole and the via hole, one side of the profile is welded with one side edge of the rectangular hole,the other side of the profile is welded with the wall plate through a complementary plate, the complementary plate partially covers the rectangular hole, and one side, close to the deck, of the complementary plate is welded with the deck. The through holes are formed in the wall plate of the ship, so that the sectional material can penetrate through the wall plate. The reinforcing plates at the positions of the wall plates are arranged to be connected with the deck in a welded mode, the R holes between the sectional materials and the wall plates are removed, on the premise that the design strength and the flowing water requirement are met, and the reinforcing plate and R hole wrap angle welding at the positions of all the through holes can be effectively reduced, so grinding work, large-amplitude welding and grinding workloads are reduced, and the working efficiency is improved.
本发明公开一种船舶型材贯穿结构,在船舶的壁板上设置有用于贯穿型材的贯穿孔,贯穿孔包括贯穿开设于壁板上的矩形孔,壁板上对应型材的顶部开设有过孔,过孔的相邻两条边通过圆弧过渡,过孔与贯穿孔连通,型材贯穿于矩形孔和过孔内,型材的一侧与矩形孔的一条侧边焊合,另一侧通过补板与壁板焊接连接,补板部分覆盖矩形孔,补板靠近甲板的一侧与甲板焊接连接。通过在船舶的壁板上开设贯穿孔,可实现型材贯穿壁板。将壁板位置的补板设置与甲板焊接连接,并且去除型材与壁板之间的R孔,在满足设计强度及流水要求的前提下,可有效的减少每个贯穿孔位置补板及R孔包角焊接,从而实现减少打磨工作,大幅度焊接和打磨工作量,提高了工作效率。
Ship profile penetrating structure
船舶型材贯穿结构
2020-06-12
Patent
Electronic Resource
Chinese
IPC: | B63B Schiffe oder sonstige Wasserfahrzeuge , SHIPS OR OTHER WATERBORNE VESSELS |
A Cost-Effective Approach to Penetrating Ship Structure
Online Contents | 1997
|European Patent Office | 2024
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