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    Title :

    Investigation of viscoelastic effect of moulding compound on the warpage and stresses of a power plastic package


    Additional title:

    Untersuchung des viskoelastischen Effekts des Ueberzugs fuer die Einkapselung leistungselektronischer Bauteile auf ihre Verformung und Belastung.


    Contributors:

    Published in:

    Publication date :

    1999


    Size :

    23 pages


    Remarks:

    Int.J.of Veh.Des.;21(1999)4/5 ;372-394


    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English



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