Investigation of viscoelastic effect of moulding compound on the warpage and stresses of a power plastic package
Untersuchung des viskoelastischen Effekts des Ueberzugs fuer die Einkapselung leistungselektronischer Bauteile auf ihre Verformung und Belastung.
Int.J.of Veh.Des. ; 21 , 4/5
1999
23 pages
Int.J.of Veh.Des.;21(1999)4/5 ;372-394
Article (Journal)
English
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