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    Title :

    Integration of simulation and testing for microelectronics package reliability improvement


    Additional title:

    Integration von Simulation und Test mikroelektronischer Packages zur Erhoehung der Zuverlaessigkeit.



    Publication date :

    1998


    Size :

    15 pages


    Remarks:

    SAE-Paper;980345;1998;Electronic Packaging;SAE Spec.Publ.; SP-1345


    Type of media :

    Miscellaneous


    Type of material :

    Print


    Language :

    English



    Integration of Simulation and Testing for Microelectronics Package Reliability Improvement

    Li, Q. / Dougherty, D. / Yong Li Xu et al. | British Library Conference Proceedings | 1998


    Integration of Simulation and Testing for Microelectronics Package Reliability Improvement

    Dougherty, David / Li, Quan / Xu, Yong Li | SAE Technical Papers | 1998


    Microelectronics Reliability

    C. Mayberry / J. Bernstein | NTIS | 2017