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    Title :

    Current status and future trends of electronic packaging in automotive applications


    Additional title:

    Gegenwaertiger Stand und zukuenftige Trends der Unterbringung elektronischer Bauteile im Fahrzeug.


    Contributors:

    Publication date :

    1990


    Size :

    9 pages


    Remarks:

    SAE-Paper;901134;1990;Vehicle Electronics in the 90s:Proc. of the Int.Congr.on Transp.Electronics;SAE Proc.; P-233


    Type of media :

    Miscellaneous


    Type of material :

    Print


    Language :

    English



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