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    Title :

    Neues Verfahren zum Bonden von LED und Leistungschips


    Additional title:

    New technology for bonding LEDs and power chips.



    Published in:

    Publication date :

    2017


    Size :

    5 pages


    Remarks:

    ATZ elektronik;12(2017)1 ;58-63


    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    German