Innovative die bonding technology for mechatronic packaging of automotive power electronics
Eine innovative Die-Bonding-Technologie fuer mechatronische Fahrzeugsysteme.
Ing.de l Automob. ; 784
2006
3 pages
Ing.de l Automob.;(2006)784 ;50-52
Article (Journal)
English
Innovative connectivity for power dice in mechatronic packaging of automotive power electronics
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