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    Title :

    Innovative die bonding technology for mechatronic packaging of automotive power electronics


    Additional title:

    Eine innovative Die-Bonding-Technologie fuer mechatronische Fahrzeugsysteme.


    Contributors:

    Published in:

    Publication date :

    2006


    Size :

    3 pages


    Remarks:

    Ing.de l Automob.;(2006)784 ;50-52


    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English



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