Innovative die bonding technology for mechatronic packaging of automotive power electronics
Eine innovative Die-Bonding-Technologie fuer mechatronische Fahrzeugsysteme.
Ing.de l Automob. ; 784 ; 50-52
2006
3 pages
Ing.de l Automob.;(2006)784 ;50-52
Aufsatz (Zeitschrift)
Englisch
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