Thermal Performance of Silicon-Die/Water-Cooled Heat-Sink Assembly: Experimental Investigation
E. Marotta, M. Ellsworth, S. Mazzuca, J. Eberth
Journal of Thermophysics and Heat Transfer ; 18 , 2 ; 193-202
2004-01-01
10 pages
Article (Journal)
Electronic Resource
English
Multilead, Vaporization-Cooled Soldering Heat Sink
Online Contents | 1995
Multilead, Vaporization-Cooled Soldering Heat Sink
NTRS | 1995
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