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    Title :

    Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn–58Bi solder joint


    Contributors:
    Ismathullakhan, S. (author) / Lau, H. (author) / Chan, Y. c. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 19 , 7 ; 1069-1080


    Publication date :

    2013-01-01


    Size :

    12 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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