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    Title :

    Through-silicon via technologies for interconnects in RF MEMS


    Contributors:
    Zhu, J. (author) / Yu, Y. (author) / Hou, F. (author) / Chen, C. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 16 , 7 ; 1045-1049


    Publication date :

    2010-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83




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