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    Title :

    Solder bonding with a buffer layer for MOEMS packaging using induction heating


    Contributors:
    Hu, C. C. (author) / Wen, S. Y. (author) / Hsu, C. P. (author) / Chang, C. W. (author) / Shih, C. T. (author) / Lee, H. W. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 12 , 10-11 ; 1011-1014


    Publication date :

    2006-01-01


    Size :

    4 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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