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    Title :

    Thermal Displacement and Strain Fields Measurement of Electronic Package, Stacked-MCP, by Phase-Shifting Moire Interferometry Using Wedged Glass Plate


    Contributors:
    Morita, Y. (author) / Arakawa, K. (author) / Todo, M. (author)


    Publication date :

    2005-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    Unknown


    Classification :

    DDC:    629.8



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