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    Title :

    Modular parametric finite element modelling for reliability-studies in electronic and mems packaging


    Contributors:
    Wunderle, B. (author) / Auersperg, J. (author) / Grosser, V. (author) / Kaulfersch, E. (author) / Wittler, O. (author) / Michel, B. (author)

    Published in:

    Publication date :

    2004-01-01


    Size :

    7 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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