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    Title :

    Solder Void Modeling and Its Influence on Thermal Characteristics of MOSFETs in Automotive Electronics Module



    Conference:

    WCXTM17: SAE world congress experience



    Publication date :

    2017-01-01


    Size :

    ALL-ALL



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English



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