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    Title :

    Low-Temperature Sintering of Nanoscale Silver Paste for High-Temperature Power Chip Attachment



    Conference:

    5th, International conference on integrated power electronics systems ; 2008 ; Nuremberg, Germany



    Publication date :

    2008-01-01


    Size :

    6 pages


    Remarks:

    Also held on CD-ROM




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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