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    Title :

    Aluminum Encapsulated APG High Conductivity Thermal Doubler



    Conference:

    49th, Structures, structural dynamics and materials conference ; 2008 ; Schaumburg, IL



    Publication date :

    2008-01-01


    Size :

    6 pages



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





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