Effects of Thermal and Vibrational Cycles on Stresses in Lead-Free Solder Joints AIAA Paper
45th, AIAA aerospace sciences meeting ; 2007 ; Reno, NV
2007-01-01
2007-619-2007-1272
Papers in the range 2007 17 to 1467 with gaps. Held on CD-ROM
Conference paper
English
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Behaviour of lead-free solder joints under thermal and mechanical stresses
Tema Archive | 2000
|Avionics Mission Cycles for Constellation AIAA Paper
British Library Conference Proceedings | 2007
|