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    Title :

    Dicing Laminated Wafer for QFN 3D Stacked Die Packaging


    Contributors:
    Abdullah, S. (author) / Endut, Z. (author) / Ahmad, I. (author) / Jalar, A. (author) / Yusof, S.M. (author) / Chua, S.-J.

    Conference:

    SYMPOSIUM D, Semiconductor photonics: nano-structured materials and devices ; 2007 ; Singapore



    Publication date :

    2008-01-01


    Size :

    4 pages


    Remarks:

    Includes bibliographical references and index; Held as part of the International conference on materials for advanced technologies (ICMAT) 2007




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





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