Microsensor Packaging for High Temperature and Harsh Environment Applications
9th, International conference on engineering, construction, and operations in challenging environments; Earth & Space 2004 ; 2004 ; League City, Tex
2004-01-01
6 pages
Includes bibliographical references and index
Conference paper
English
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
| British Library Online Contents | 2002
4H-SiC Integrated circuits for high temperature and harsh environment applications
| BASE | 2014
High-temperature fiber optic sensors for harsh environment applications [5272-28]
| British Library Conference Proceedings | 2004
4H-SiC Integrated circuits for high temperature and harsh environment applications
| BASE | 2013
Stereolithography on silicon for microfluidies and microsensor packaging
| British Library Online Contents | 2003