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    Title :

    Failure Mechanisms of Ball Grid Array Packages Under Vibration and Thermal Loading



    Conference:

    Session, Reliability and robust design in automotive engineering



    Publication date :

    2004-01-01


    Size :

    6 pages


    Remarks:

    Paper nos 2004-01-0237 to 2004-01-1752 with gaps. Held as part of the SAE 2004 world congress



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English