Failure Mechanisms of Ball Grid Array Packages Under Vibration and Thermal Loading
Session, Reliability and robust design in automotive engineering
01.01.2004
6 pages
Paper nos 2004-01-0237 to 2004-01-1752 with gaps. Held as part of the SAE 2004 world congress
Aufsatz (Konferenz)
Englisch
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Failure mechanisms of ball grid array packages under vibration and thermal loading
Kraftfahrwesen | 2004
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SAE Technical Papers | 2004
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British Library Conference Proceedings | 2004
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