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    Title :

    2003-01-1171 Thermoformed Soft Instrument Panel



    Conference:

    Session, Advances in interiors & instrument panels ; 2003 ; Detroit, MI



    Publication date :

    2003-01-01


    Size :

    4 pages


    Remarks:

    Paper nos 2003-01-0230 to 2003-01-1175 with gaps. Held during the SAE 2003 World Congress



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Thermoformed Soft Instrument Panel

    Woodman, Daniel | SAE Technical Papers | 2003


    Thermoformed soft instrument panel

    Woodman,D. / GE Plastics,US | Automotive engineering | 2003


    Nr. 1171

    DataCite | 1867

    Free access

    No. 1171

    DataCite | 1926