Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Investigation into the Effect of Gel Hardness on Solder Joints



    Conference:

    World congress, Society of Automotive Engineers; SAE 2001 world congress ; 2001 ; Detroit, MI



    Publication date :

    2001-01-01


    Size :

    ALL


    Remarks:

    Separate papers nos. 2001-01-0001 to 2001-01-1356 with gaps held only; No contents available


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Investigation into the Effect of Gel Hardness on Solder Joints

    Naylis, Dan / Berry, Paul / Barcley, Tina | SAE Technical Papers | 2001


    Investigation into the effect of gel hardness on solder joints

    Barcley,T. / Berry,P. / Naylis,D. et al. | Automotive engineering | 2001


    Compound solder joints

    Batista, R. I. / Simonson, R. B. | NTRS | 1976


    Through Hole Solder Joints

    Pierce | Online Contents | 1994


    Stress-relieved solder joints

    Zemenick, C. J. | NTRS | 1980