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    Title :

    The Use of Physics-of-Failure Analysis to Predict the Reliability of Semiconductor Devices



    Conference:

    International congress, Society of Automotive Engineers ; 1999 ; Detroit; MI



    Publication date :

    1999-01-01


    Size :

    ALL


    Remarks:

    Nos 1999-01-0001 to 1999-01-1336 with gaps



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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