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    Title :

    A Low-Cost Electroless Plating Method for Producing Flip-Chip Bondable and Wire-Bondable Circuit Pads for Smart Pixel Application



    Conference:

    Annual meeting; 11th, IEEE: Lasers and Electro-Optics Society; LEOS '98 ; 1998 ; Orlando; FL



    Publication date :

    1998-01-01


    Size :

    2 pages


    Remarks:

    IEEE cat no: 98CH36243




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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