A Low-Cost Electroless Plating Method for Producing Flip-Chip Bondable and Wire-Bondable Circuit Pads for Smart Pixel Application
Annual meeting; 11th, IEEE: Lasers and Electro-Optics Society; LEOS '98 ; 1998 ; Orlando; FL
1998-01-01
2 pages
IEEE cat no: 98CH36243
Conference paper
English
LEOS , lasers , IEEE , electro-optics
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