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    Title :

    Thermomechanical Multi-Domain Stress Modeling for Fatigue Analyis of Electronic Packaging



    Conference:

    Aerospace conference ; 1998 ; Snowmass; CO



    Publication date :

    1998-01-01


    Size :

    10 pages


    Remarks:

    IEEE cat no 98TH8339




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





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