Measurement of Die Stress in Advanced Electronic Packaging for Space and Terrestrial Applications
Conference; 2nd, Commercial development of space ; 1997 ; Albuquerque; NM
Commercial development of space ; 387//pt2 ; 819-824
AIP CONFERENCE PROCEEDINGS ; 387//pt2
1997-01-01
6 pages
Held as part of the space technology & applications international forum. Theme title: Looking forward: opening the space frontier
Conference paper
English
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