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    Title :

    Measurement of Die Stress in Advanced Electronic Packaging for Space and Terrestrial Applications



    Conference:

    Conference; 2nd, Commercial development of space ; 1997 ; Albuquerque; NM


    Published in:

    Publication date :

    1997-01-01


    Size :

    6 pages


    Remarks:

    Held as part of the space technology & applications international forum. Theme title: Looking forward: opening the space frontier




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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