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    Titel :

    Measurement of Die Stress in Advanced Electronic Packaging for Space and Terrestrial Applications



    Kongress:

    Conference; 2nd, Commercial development of space ; 1997 ; Albuquerque; NM


    Erschienen in:

    Erscheinungsdatum :

    01.01.1997


    Format / Umfang :

    6 pages


    Anmerkungen:

    Held as part of the space technology & applications international forum. Theme title: Looking forward: opening the space frontier




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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